| 摘要 |
Method for producing fine line circuit boards utilizing both sides thereof, with through-hole plating wherein the board is drilled and conductive metal clad, the surface is passivated and the holes and the surfaces are electroplated to a desired thickness. Thereafter the surface electroplate is peeled off the board, leaving the plating in the holes. Subsequently the board is masked in a desired pattern, etched to remove the cladding and form a circuit, and then the mask is removed and solder is applied to the plated holes.
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