| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board capable of ensuring the stable thickness of solder between the chip component surface and the conductor land surface.SOLUTION: In a printed circuit board which comprises: an insulation substrate; a wiring pattern including a conductor land formed on the insulation substrate; and solder resist formed in the outer peripheral portion of the conductor land, there is a different land between left and right lands. The whole surface of the different land is subjected to over-resist.SELECTED DRAWING: Figure 3 |
