发明名称 Heat pump for heating building - uses boreholes in ground near building to act as heat exchanger surfaces
摘要 <p>The heat pump system incorporates a number of bore holes (1,2) in the ground, located below or very close to a building (3), and acting as heat exchanger surfaces. Heating surfaces, e.g. pipes or other fluid-conducting systems, form an integral circuit within the bores, and permit ground heat exchange. The system may be incorporated during construction of the building, and may also consist of horizontal or inclined bore holes.</p>
申请公布号 DE3005132(A1) 申请公布日期 1981.08.20
申请号 DE19803005132 申请日期 1980.02.12
申请人 HILBERS,HEINRICH,ING. 发明人 HILBERS,HEINRICH,ING.
分类号 (IPC1-7):24J3/04 主分类号 (IPC1-7):24J3/04
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