发明名称 |
DIE-BONDING LAYER FORMATION FILM, WORKPIECE HAVING DIE-BONDING LAYER FORMATION FILM ATTACHED THERETO, AND SEMICONDUCTOR DEVICE |
摘要 |
A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ or more and 50 N/2 mm□ or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history. |
申请公布号 |
SG11201607777U(A) |
申请公布日期 |
2016.11.29 |
申请号 |
SG11201607777U |
申请日期 |
2015.03.16 |
申请人 |
LINTEC CORPORATION |
发明人 |
AZUMA, YUICHIRO;SUZUKI, HIDEAKI;SAIKI, NAOYA;SAGAWA, YUTA |
分类号 |
H01L21/52 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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