| 摘要 |
Provided is a method for manufacturing a smart card, comprising: mounting a secure chip (230) on a modular circuit board (210) to obtain a secure chip module, one layer of the modular circuit board (210) being provided with a plurality of contact points (220) insulated from each other; planting a solder ball (240) on the secure chip solder pad (311) of the main circuit board (300); according to the position of the secure chip solder pad (311) on the main circuit board (300), milling out a groove (800) on the substrate on which the main circuit board (300) is packed, such that the solder ball (240) on the secure chip solder pad (311) is visible at the bottom of the groove (800); packing the secure chip module into the groove (800), and by means of the solder ball (240) on the secure chip solder pad (311), mounting the secure chip module onto the main circuit board (300). The method reduces the restrictions to the wiring of the main circuit board caused by the contact points on the surface of the smart card, thus improving the quality of the wiring of the main circuit board; furthermore, electronic circuit-level expansion may be performed on the contact point module and the secure chip, increasing the scalability of the smart card. |
