| 摘要 |
PURPOSE:To complete assembly in a short period by arranging a die bonding process composing a full automatic IC assembling system and a plurality of wire bonding mechanisms following the die bonding are arranged in a beeline wherein they are connected by using rails and a semiconductor device to be treated is transferred by a truck. CONSTITUTION:A lead frame 13 and a belt conveyor 16 loading the frame 13 on a truck 15 are provided in a loading station E composing a die bonding mechanism 1 and predetermined die bondig work is performed to the frame 13 in the mechanism 1. Next, plurally divided wire bonding mechanisms 2-6 are consecutively provided behind the mechanism 1 because a lot of work are necessary. The mechanisms 2-6 and the mechanism 1 are connected to the first and the second rails 11 and 12. Next, the frame 13 finished the die bonding is moved by the first and the second rails 11 and 12 and predetermined stations B and C are selected in accordance with processes to perform all wire bonding processes and the frame 13 is sent to a loading station D to wait for the loading for the next process. |
