| 摘要 |
The present invention relates to curable compositions comprising specific silicon-containing polymers, at least one vinyl carbosiloxane polymer, and at least a catalyst, cured products obtainable by heating such composition, and the use of said composition as semiconductor encapsulating material and/or electronic elements packaging material. More particularly, the invention relates to hydrosilylation-curable compositions that cure to form polycarbosiloxane products having optical clarity, resistance to high temperature, and very good moisture and gas barrier properties. This invention further relates to reliable light emitting devices encapsulated with these polycarbosiloxane compositions. |
| 主权项 |
1. A curable composition, comprising:
(A) at least one organopolysiloxane A represented by the following formula (1):
[R1R2R3SiO1/2]M[R4R5SiO2/2]D[R6SiO3/2]T[SiO4/2]Q,wherein R1, R2, R3, R4, R5, and R6, each independently designates a methyl group, an ethyl group, a vinyl group, a phenyl group, with the proviso that each molecule comprises at least 2 vinyl groups directly bonded to silicon; and M, D, T, and Q each represents a number ranging from 0 to less than 1, provided that M+D+T+Q is 1, and
(B) at least one organopolysiloxane B represented by the following formula (2):
[R7R8R9SiO1/2]M′[R10R11SiO2/2]D′[R12SiO3/2]T′[SiO4/2]Q′, (2),wherein R7, R8, R9, R10, R11, and R12, each independently designates a methyl group, an ethyl group, a phenyl group, or hydrogen, with the proviso that each molecule comprises at least 2 phenyl groups and 2 hydrogen atoms directly bonded to silicon, and M′, D′, T′, and Q′ each represents a number ranging from 0 to less than 1, provided that M′+D′+T′+Q′ is 1,
(C) at least one vinyl carbosiloxane polymer comprising the structureswithin each molecule, wherein R13, R14, R15, R16 R17, R18 R19, and R20 each independently designates a methyl group, an ethyl group, a vinyl group, or a phenyl group, with the proviso that each molecule comprises at least 2 vinyl groups and at least one phenyl group directly bonded to silicon, and X is ethylene or arylene, and
(D) at least a catalyst. |
