发明名称 Thin Film Solar Cell Backside Contact Manufacturing Process
摘要 Embodiments of the invention related to a method for manufacturing a thin film solar cell backside contact. Prior to application of materials, a planar substrate is provided and an associated backside of the substrate is modified to form one or more pedestals. The modified substrate is layered with multiple layers of material, including a conducting layer, a reflective layer, and a passivation layer. The layered backside substrate is polished to expose portions of the conducting layer at discrete locations on the backside of the substrate. The exposed portions of the conducting layer maintain direct electrical communication between an absorber layer deposited on the layered backside substrate and the conducting layer.
申请公布号 US2016372613(A1) 申请公布日期 2016.12.22
申请号 US201514746413 申请日期 2015.06.22
申请人 International Business Machines Corporation 发明人 Eickelmann Hans-Juergen;Kellmann Ruediger;Kuehl Hartmut;Schmidt Markus
分类号 H01L31/0224;H01L31/0445;H01L31/0232;H01L31/18;H01L31/0216;H01L31/032 主分类号 H01L31/0224
代理机构 代理人
主权项 1. A method for manufacturing a thin film solar cell backside contact comprising a layered substrate, the method comprising: modifying a backside substrate, including deforming a first side of the substrate, wherein a surface profile on the first side of the substrate includes one or more extensions; creating a multi-layered substrate in communication with the modified backside, including depositing a conducting layer on the modified substrate, depositing a reflective layer on the conducting layer, and depositing a passivation layer on the reflective layer; polishing the surface profile of the layered substrate, wherein the polishing exposes the conducting layer adjacent to the one or more extensions, and the polishing forming a backside surface; depositing an absorber layer across the polished surface; depositing a buffer layer across the absorber layer; depositing a transparent oxide across the buffer layer; applying an anti-reflective coating to the transparent oxide; and forming a contact grid across the backside of the layered substrate, the contact grid in communication with the transparent oxide layer.
地址 Armonk NY US