发明名称 |
DOUBLE-RESURF LDMOS WITH DRIFT AND PSURF IMPLANTS SELF-ALIGNED TO A STACKED GATE "BUMP" STRUCTURE |
摘要 |
A double-RESURF LDMOS transistor has a gate dielectric structure including a shallow field “bump” oxide region and an optional raised dielectric structure that provides a raised support for the LDMOS transistor's polysilicon gate electrode. Fabrication of the shallow field oxide region is performed through a hard “bump” mask and controlled such that the bump oxide extends a minimal depth into the LDMOS transistor's drift (channel) region. The hard “bump” mask is also utilized to produce an N-type drift (N-drift) implant region and a P-type surface effect (P-surf) implant region, whereby these implants are “self-aligned” to the gate dielectric structure. The N-drift implant is maintained at Vdd by connection to the LDMOS transistor's drain diffusion. An additional Boron implant is utilized to form a P-type buried layer that connects the P-surf implant to the P-body region of the LDMOS transistor, whereby the P-surf implant is maintained at 0V. |
申请公布号 |
US2016372578(A1) |
申请公布日期 |
2016.12.22 |
申请号 |
US201615254836 |
申请日期 |
2016.09.01 |
申请人 |
Tower Semiconductor Ltd. |
发明人 |
Levy Sagy;Levin Sharon;Berkovitch Noel |
分类号 |
H01L29/66;H01L21/3105;H01L21/265;H01L27/06;H01L21/266;H01L21/02;H01L21/8238;H01L21/8234;H01L29/06;H01L21/225 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a double-RESURF LDMOS transistor on a semiconductor substrate, the method comprising:
forming a well region in the semiconductor substrate using a dopant having a first conductivity type, and a base oxide layer on an upper surface of the semiconductor substrate over a first portion of the well region; forming a mask on the upper surface such that the mask defines an opening that exposes a portion of the upper surface located over a second portion of the well region; forming a drift implant region and a surface field implant in the semiconductor substrate by implanting associated dopant materials through the opening defined in the mask; forming a gate dielectric structure inside the opening defined in the mask such that both the drift implant region and the surface field implant are self-aligned to the gate dielectric structure; removing the mask; and forming a gate electrode on a portion of the base oxide layer and a portion of the gate dielectric structure. |
地址 |
Migdal Haemek IL |