| 摘要 |
PROBLEM TO BE SOLVED: To form a positive photoresist based on a polyimide resin by using an alkali aqueous solution as a developing solution and through a developing process with a short developing time.SOLUTION: A positive photoresist is formed by disposing a photoresist layer containing a photosensitive resin composition on a substrate, masking the layer with a desired pattern, irradiating the pattern surface with UV rays, and treating the photoresist layer with a developing solution that is an alkali aqueous solution. The photosensitive resin composition comprises a polyimide resin and a photoacid generator; the polyimide resin is prepared by allowing an acid dianhydride to react with a diamine compound having a low molecular weight; and the acid dianhydride contains an alicyclic acid dianhydride. The acid dianhydride may be a mixture of an alicyclic acid dianhydride and an aromatic acid dianhydride. A ratio (molar ratio) of the alicyclic acid dianhydride to the aromatic acid dianhydride is preferably 8:2 to 4:6. The diamine compound is preferably an aromatic diamine. |
