| 摘要 |
PURPOSE:To remove a wafer from a rubber sheet, by rolling a synthetic rubber sheet between a supporting base and a wafer from one end. CONSTITUTION:The wafer 2 is held by a plate 4, and the synthetic rubber sheet 3 is fixed to the plate by a member 7 and attached to the back surface of the wafer. The plate 4 is pressed to a temperature controlled supporting base 1 by making a hinge 8 as a fulcrum and fixed by a screw 9. After wafer treatment, the screw 9 is removed to open the supporting base 1, and the member 7 is removed to roll the sheet 3 by making the part, supported by the member, as one end. By said system, the wafer and the sheet will sequentially be peeled off from the end of the wafer or the wafer can be handled without any damage. The member 7 is provided with screw holes 10 and fixed by the bolts 12 of a winding jig 11, and the sheet may be rolled by a handle 13. |
