| 摘要 |
PURPOSE:To enable the automation of carriage through noncontact by a method wherein an air truck to which blowing out holes in the oblique direction are formed at regular intervals is used, a wafer is sucked and floated by the blown out air, a section between a tray and a carrier is controlled and the wafer is conveyed. CONSTITUTION:The air truck 3, to a side surface thereof a guide 3-4 is mounted, is brought close and arranged to the wafer previously treated such as the wafer 2-1 placed on the tray 1, compressed air is forwarded to a cavity 3-2 and air is blown out from the blowing out holes 3-0. The wafer 2-1 floated by a jetted air current moves in the air current direction under a condition that approaches to a lower surface of the truck, the feed of air by pressure is stopped when the wafer reaches stoppers 3-3, and the wafer is conveyed to the carrier 6 through the operation of a truck 4. The wafer is attached to the tray 1 according to a process which is reverse to said process, but it can be set directing a facet in the predetermined direction because two stoppers 3-2 are fitted. Accordingly, the wafer can be conveyed automatically between the fixed positions without contact. |
