发明名称 BALL BONDING FOR WIRE
摘要 <p>A method of forming a ball on a wire by spark discharge to permit ball bonding of the wire to a component or a terminal comprises: initiating the formation of an arc between an electrode and the wire by applying between them a high voltage (V2) from a high-voltage, low-current source (46, 64 to 76) which is effective only until the arc is formed; and, once the arc has been formed, drawing current for forming the ball from a low-voltage (V1), high-current source (44, 50-56). Apparatus for forming a ball on a wire by this method can be completely safe, by using a very low capacitance (76) in the high voltage source, which is made to discharge through a resistor (74). Sufficient power for forming the ball can be provided by the low-voltage source provided that it incorporates a very large capacitance (52). The method can alternatively be performed with the use of electronic power supplies, supplied for example by constant-current sources.</p>
申请公布号 JPS5740947(A) 申请公布日期 1982.03.06
申请号 JP19810100722 申请日期 1981.06.30
申请人 UERUDEINGU INST:ZA 发明人 ARUBAATO DABURIYU KAATAA
分类号 H01L21/60;B23K20/00;H01L21/607 主分类号 H01L21/60
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