发明名称 COOLING BODY
摘要 PURPOSE:To improve the characteristics of heat transmission, and to prevent thermal fracture in a semiconductor element, etc. by dividing the cooling body into a base body and a fin and roughening each surface. CONSTITUTION:The cooling body is divided into the base body 1 and the fins 2, grid grains 6 consisting of iron, etc. are jetted from a nozzle 7 and made collide onto each heat transfer surface contacting with a coolant, and the surfaces are roughened. Accordingly, a section, which is difficult to be treated, such as the clearance sections of the fins can also be treated uniformly because the surfaces are roughened under a condition that the base body 1 and the fins 2 are each divided. After the roughening is completed, the base body 1 and the fins 2 are assembled and the cooling body is formed. Heat is radiated into the refrigerant liquid through the heat transmission of boiling from the heat transfer surfaces contacting with the refrigerant liquid of the base body 1 and the fins 2 by immersing the cooling body into the refrigerant liquid.
申请公布号 JPS57104246(A) 申请公布日期 1982.06.29
申请号 JP19800180880 申请日期 1980.12.19
申请人 MITSUBISHI DENKI KK 发明人 FUJII MASAO;MORIHIRO YOSHIYUKI;SEICHI YOSHIO;KASAHARA KIYOSHI
分类号 H05K7/20;F28F3/02;H01L23/427;H01L23/44 主分类号 H05K7/20
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