发明名称 METHOD OF FORMING REFRACTORY METALLIC SILICIDE OF LOW RESISTANCE ON SUBSTRATE
摘要 A method of forming low resistance silicided gates or interconnects is described wherein a refractory metal and silicon is simultaneously co-deposited to form a composite layer which is thereafter heat treated in a non-oxidizing atmosphere to form the polycrystalline state of the silicide.
申请公布号 JPS57136373(A) 申请公布日期 1982.08.23
申请号 JP19820002184 申请日期 1982.01.08
申请人 RCA CORP 发明人 JIYOSEFU MAIKERU SHIYAU
分类号 H01L29/78;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 主分类号 H01L29/78
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