发明名称 BAKING METHOD AND BAKING DEVICE USED FOR SAID METHOD
摘要 PURPOSE:To conduct uniform baking with high accuracy, and to shorten treating time by turning a wafer at the speed of revolution corresponding to the distribution of the intensity of a microwave and giving equal microwave energy extending over the whole surface of the wafer. CONSTITUTION:A door 4 is opened, and the wafer 2 is held on a wafer chuck 5. A motor 6 is operated to turn the wafer 2, a magnetron 7 is actuated, and microwaves are projected from an antenna 9. The wafer 2 is induction-heated and generates heat by the microwaves projected. In this case, the equal distribution of temperature is obtained in the whole wafer 2 because the wafer chuck 5 is rotated at the necessary speed of revolution in response to the distribution of the intensity of the microwaves working to the wafer 2. The temperature of the wafer 2 is measured by means of a temperature sensor 10, and the measuring information is processed by a thermometer section 11, and transmitted to a control section 12. A power supply section 13 controls the quantity of microwaves outputted from the magnetron 7 according to the information of the quantity of deviation from the control section 12, and the temperature of the wafer 2 is controlled.
申请公布号 JPS57154831(A) 申请公布日期 1982.09.24
申请号 JP19810039428 申请日期 1981.03.20
申请人 HITACHI SEISAKUSHO KK 发明人 AMADA HARUO
分类号 G03F7/26;G03F7/40;H01L21/027;(IPC1-7):01L21/30 主分类号 G03F7/26
代理机构 代理人
主权项
地址