| 摘要 |
<p>PURPOSE:To facilitate the control of resistance value and the conduction of the isolated conductor for the title semiconductor device by a method wherein, when the conductor is composed of a closed circuit through the intermediary of a resistor, the condutor is isolated at the position where a component part is mounted. CONSTITUTION:When a closed circuit is composed of a resistor in a conductor device such as a thick film integrated circuit and the like, the conductor is to be isolated from the closed circuit when the resistance value of the resistor is adjusted by trimming. When a part of the closed ciruit is led out as the electrode for an exterior lead terminal, the electrode region 1 whereon the lead terminal will be mounted is isolated by trimming and the like using a laser beam. After the resistance value has been adjusted, a clip type lead terminal 6 is installed in such a manner that it comes in contact with both isolated electrode regions and connected to the isolated electrode region 1 using solder 4. The position where the elements such as a capacitor, a transistor and the like will be provided may be used as the position at which the conductor of the closed circuit is isolated.</p> |
