| 摘要 |
<p>PURPOSE:To obtain a laminated substrate having excellent mechanical strength and electrical properties, by applying a specified solvent to a heat-resistant substrate composed of an aromatic polyamide and bonding by means of pressing etc. in the presence of an aromatic polyamide solution. CONSTITUTION:To a heat-resistant substrate composed of a pulp like object of an aromatic polyamide at least on one side and of a pulp like object etc. of, e.g., an aromatic polyester on another side, a solvent which is compatible with a polar organic solvent for the aromatic polyamide and a non-solvent for the aromatic polyamide, pref. xylene or toluene, is applied to impregnate said substrate, and then bonding is performed by heating to evaporate said solvent (pref. at 10-140 deg.C), or pressing (pref. at 1-50kg/cm<2>, for several sec -120min) in the presence of an aromatic polyamide solution (pref. at a concentration of 0.5- 40wt%). EFFECT:Raw material for electrical application of excellent workability is obtained. Bonding is possible without detriment to the laminated substrate as porous raw material for electrical application.</p> |
