| 摘要 |
PURPOSE:To enable mass production by forming a bump required when the chip is gang-bonded, to the nose section of a finger through a simple process. CONSTITUTION:Metallic (copper) foil 4 is set up onto an insulating film substrate 1 to which a device hole 2 for arranging the chip of an IC is formed, and a positive type resist 5, a mask 7, to which a desired finger pattern 7a is disposed, and transparent glass 6 are arranged onto the foil and exposed and developed. A back attaching agent 9 preventing etching from the back side of the insulating film substrate 1 is applied to the back side of the substrate 1, and a wiring section and the finger 8 are obtained through etching. Re-exposure and development are conducted by a mask 10 with a pattern through which beams do not collide with the nose section 8a of the finger 8 and another wiring section separated from the nose section 8a by slight width, and a concave section 13 is shaped through half etching. After then, the resist is exfoliated. |
