| 摘要 |
PURPOSE:To relax the landing impact of a capillary by a method wherein the bonding surface begins lowering at slower speed than the contact speed of the capillary immediately before the capillary that holds a ball at the end of a wire contacts the bonding surface, and then bonding is performed. CONSTITUTION:When a signal is given from the controller 18 of a wire bonding device body to the controller 16 of a bonding cam drive motor 2, the motor 2 and a bonding cam 1 rotate and a capillary 6 begins lowering. Immediately before the capillary 6 lands on the bonding surface, a signal is generated in the controller 16 of the motor 2 and transmitted to the controller 15 of a bonding surface elevating drive motor 14. The controller 15 allowing the motor 14 and thus a cam 13 to rotate, a cam follower 17 fixed to a heater block 12 follows the bonding surface elevating drive cam 13 to lower the bonding surface. Then, the lowering speed of the bonding surface is made slower than the landing speed of the capillary 6. |
