| 摘要 |
PURPOSE:To facilitate control of production schedule of a semiconductor device by a computer by a method wherein a card formed in the same type with a semiconductor wafer is accomodated in a carrier being made as to correspond to one sheet of the semiconductor wafer, while perforations concerning the indicating matters in relation to a lot of semiconductor wafer are formed in the card thereof. CONSTITUTION:The card 7 is a disk being nearly the same type with the semiconductor wafer, and is possible to be accommodated in the carrier being made as to correspond to one sheet of the semiconductor wafer, perforations are performed therein in single line or in plural lines, the holes 7a, 7a'... are formed at first, and the hole 7b or 7c, etc., are formed to indicate the types of products, the lot number, the progress of work, the condition of treatment, etc., or to indicate a starting dot of read, the center of group of the penetrating holes, etc. Penetration of the holes are performed at every progresses of work, the processes, or the penetrating holes are read and the informations are inputted into the central processing unit. When the process is to be carried forward in the desired manner by performing the various treatment processes A1...AN, B1...BN in order, or by repeating such as A1 B1 C1 A1, or by jumping over like as A1 C1, the perforations concerning the principal items are perforated by a sensor 1, a sensor 2, etc., and the perforation are read to be sent to the CPU for storing. |
