发明名称 METHOD OF MOLDING FILM
摘要 PURPOSE:To mold a film having desired width and thickness, by applying electric field to a melted film that is melted and extruded, and cooling the film by a cooling roller, the intensity of the electric field being changed with the slit of a T-die, the rotational speed of the cooling roller, etc. being kept constant. CONSTITUTION:The melted film 7 of a polyethylene or the like is extruded from the T-die at the tip of an extruder 1, and after electric field is applied from an electrode 6, the film is brought in contact with the cooling roller 5 to be cooled and solidified. At this time, the voltage energized to the electrode 6 and the space between the electrode 6 and the film are varied to change the width of the film to obtain a film having a desired width. EFFECT:The transparency of the film is high and the surface thereof is smooth.
申请公布号 JPS5881127(A) 申请公布日期 1983.05.16
申请号 JP19810180872 申请日期 1981.11.10
申请人 MATSUSHITA DENKI SANGYO KK 发明人 TAKEDA KOUJI;YAMAMOTO KAZUMASA;KITAO TOSHIO;KIMURA YOSHIHARU
分类号 B29B7/00;B29C31/00;B29C41/26;B29C47/00;B29C47/88 主分类号 B29B7/00
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