发明名称 パッケージ、光学モジュール、及び電子機器
摘要 A base substrate, a lid that forms an internal space capable of housing a device (variable-wavelength interference filter), and a brazing filler that joins the lid to the base substrate are provided. The lid has: a lid joining portion having a base facing surface that faces the base substrate, an inner lateral surface that continues at an inner end on the side of the internal space of the base facing surface and faces the internal space, an outer lateral surface, and an upper surface; and a lid sidewall portion standing up in a direction away from the base substrate from the upper surface of the lid joining portion. The brazing filler is provided along the base facing surface and the outer lateral surface from the inner end to the upper end of the outer lateral surface via an outer end opposite to the inner end.
申请公布号 JP6036303(B2) 申请公布日期 2016.11.30
申请号 JP20130000355 申请日期 2013.01.07
申请人 セイコーエプソン株式会社 发明人 今井 英生
分类号 H01L23/02;H01L31/02 主分类号 H01L23/02
代理机构 代理人
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