| 摘要 |
PURPOSE:To perform self alignment for a stepped undulating section and to simplify a process as well by a method wherein a photo-analysis type organic material is used as an insulating film and high reflection factor of metallic wiring is utilized. CONSTITUTION:On the drawing, 4 is a semiconductor substrate such as silicon, 5 is metallic wiring formed on the semiconductor substrate. Firstly, an organic material including photolysis-type sensitizer 6 is applied by a method such as spin coating. Next, baking is done at a suitable temperature to eliminate welding in the organic material, and when light 7 is equally aimed at the whole face, the organic material right above the metallic wiring out of the photolysis-type organic material strongly receives the influence of reflected light from a bed and effective amount of light being irradiated increases. When a development process is applied to the organic material, more organic material on the metallic wiring is eliminated as opposed to the organic material at the other part as shown in 8 of the photolysis-type organic material and flatness is materialized. |
