发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To radiate heat effectively from lead electrode by configurating electrode with a composite material where carbon fiber is buried in the copper matrix and by making the diameter larger than the semiconductor element. CONSTITUTION:A semiconductor element 1, heat radiating electrode plate 2 consisting of copper and composite material electrode 3 are bonded by a material 4, and an hermetically sealing insulator 6 is filled in a plate 2. The electode 3 is superior in thermal conductivity and therefore heat generated in the element 1 is quickly radiated. At this time, the heat radiated from the plate 2 flows as indicated by the broken line. It is therefore important to make the shape of electrode 3, particularly electrode diameter and electrode thickness equal or larger than those enclosed in the broken line. Heat generated by semiconductor element can be radiated more effectively than in the lead electrode side.
申请公布号 JPS58111326(A) 申请公布日期 1983.07.02
申请号 JP19810209133 申请日期 1981.12.25
申请人 HITACHI SEISAKUSHO KK;HITACHI HARAMACHI DENSHI KOGYO KK 发明人 FUKAZAWA TOORU;SAKAGAMI TADASHI;NARITA KAZUTOYO;KAWASAKI NOBORU
分类号 H01L21/52;H01L23/373 主分类号 H01L21/52
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