| 发明名称 |
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS |
| 摘要 |
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW. |
| 申请公布号 |
US2016372438(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615249535 |
申请日期 |
2016.08.29 |
| 申请人 |
Northrop Grumman Systems Corporation ;The Board of Trustees of the Leland Stanford Junior University |
发明人 |
Starkovich John A.;Silverman Edward M.;Tice Jesse B.;Peng Hsiao-Hu;Barako Michael T.;Goodson Kenneth E. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface, comprising the steps of:
removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to form a solid bond between the MNW and the adjacent surface. |
| 地址 |
Falls Church VA US |
