| 摘要 |
A process for bonding lignocellulosic material under heat and pressure, where the bonded lignocellulosic material is characterized by a low emission of formaldehyde, which comprises applying a binder to said lignocellulosic material, said binder comprising a urea-formaldehyde base resin having a ratio of formaldehyde to urea of 1.0:1-1.2:1, said base resin having essentially no free formaldehyde and said base resin when cured containing substantially more methylene groups than methylene ether groups, consolidating said lignocellulosic material and curing the binder.
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