发明名称 |
Semiconductor package |
摘要 |
A semiconductor package includes a package substrate. A first semiconductor chip is mounted on the package substrate. The first semiconductor chip includes a first chip region and first chip pads formed on a top surface of the first chip region. A second semiconductor chip is mounted on the package substrate. The second semiconductor chip includes a second chip region and second chip pads formed on a top surface of the second chip region. A boundary region having a groove divides the first chip region and the second chip region. The first chip region, the second chip region and the boundary region share a semiconductor substrate of a one-body type. |
申请公布号 |
US9455244(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201314104459 |
申请日期 |
2013.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Shin MuSeob |
分类号 |
H01L21/00;H01L25/18;H01L25/065;H01L25/10;H01L23/31;H01L23/498;H01L23/00;H01L23/522;H01L23/538 |
主分类号 |
H01L21/00 |
代理机构 |
F. Chau & Associates, LLC |
代理人 |
F. Chau & Associates, LLC |
主权项 |
1. A semiconductor package, comprising:
a package substrate; a first semiconductor chip on the package substrate, wherein the first semiconductor chip includes a first chip region and first chip pads formed on a top surface of the first chip region; and a second semiconductor chip on the package substrate, wherein the second semiconductor chip includes a second chip region and second chip pads formed on a top surface of the second chip region, wherein the first chip region and the second chip region are divided from each other by a boundary region having a groove; wherein the first chip region, the second chip region and the boundary region share a semiconductor substrate of a one-body type, and wherein an adhesive member is disposed on a bottom surface of the first and second chip regions and the boundary region, and wherein a bottom surface of the groove is disposed above a top surface of the adhesive member. |
地址 |
Suwon-Si, Gyeonggi-Do KR |