Wafer frontside-backside through silicon via

摘要

A wafer frontside-backside through silicon via and methods of manufacture are disclosed. The method includes forming a plurality of frontside metalized vias into a partial depth of a substrate. The method further includes forming a backside via in the substrate which exposes, from the backside, the plurality of frontside metalized vias. The method further includes forming a metal in the via in contact with the plurality of metalized frontside vias.

主权项

1. A method, comprising:
forming a plurality of frontside metalized vias into a partial depth of a substrate; mounting a frontside of the substrate to a glass handle wafer; forming a backside via in the substrate which exposes, from the backside, the plurality of frontside metalized vias; forming a metal in the backside via in contact with the plurality of metalized frontside vias; removing the glass handle wafer from the frontside of the substrate; and forming solder bumps on the frontside and backside of the substrate, wherein the solder bumps on the backside of the substrate are in direct contact with the metal.