| 摘要 |
PURPOSE:To obtain a semiconductor device which has moisture resistance of good efficiency of utilizing resin and good heat impact with uniform quality by providing a regulating port for controlling a flow of molten resin to be filled under pressure to sequentially seal a cavity with resin at either one of upper and lower molds. CONSTITUTION:An air vent lifting pin 19 is initially opened in a semi-opened state, a gate lifting pin 23 is opened in an open state, and molten resin 25 is filled under pressure in the first cavity 17 from a runner 15 through a gate 18. In this case, a gate lifting pin 20 is regulated, thereby regulating the flow of the molten resin 25 into the cavity 17. Then, the pins 12, 19 are opened at the opened state, and the resin 25 is filled under pressure in the second cavity 21. In this case, the opening or closing of the pin 23 is controlled, thereby adjusting the flow. Air is exhausted from an air vent 26 which is pressed by the flowed resin 25. |
