| 摘要 |
<p>PURPOSE:To strictly adjust an interval between a light emitting surface and a light receiving surface with an inexensive material by integrally forming electrode conductor patterns of conductor metal film on both side surfaces of a heat resistant resin substrate, and placing semiconductor light emitting and receiving elements on a header. CONSTITUTION:A conductor metal film 12, e.g., a Cu layer is bonded to the surface of a substrate 11 made of inexpensive glass epoxy having high heat resistance, and an adhesive 13 is bonded to the back surface. Then, a space region 14 which places a semiconductor element and a through hole region 15 are opened. Subsequently, the same conductor metal film 16 as the material of the surface, e.g., a Cu layer is bonded via the adhesive 13 on the resin 11. Thereafter, the films 12, 16 are masked, and a wiring pattern is formed. Then, the films 12, 16 are conducted by Cu electroless plating technique to the region 15, metal such as Ni, Au or the like is covered on the surface of the film 16, and a header 400 is formed.</p> |
