| 摘要 |
<p>PURPOSE:To enable to well scribe SOS wafers, etc. without generating micro cracks by a method wherein a light shielding switch which can transmit and shield the laser ray from an oscillator synchronously with a drive source which transfers a table is provided between the laser oscillator and an optical system. CONSTITUTION:After the SOS wafer 12 is fixed on a vacuum chuck 3 by suction, the negative direction of Y axis of the SOS wafer 12 wherein micro cracks are not generated is determined. A DC motor is started at the time of T1, and then the second table 22 is transferred in the negative direction of Y axis by the distance corresponding to the approximate diameter of the SOS wafer 12. The light shielding switch 11 turns ON with the start of the DC motor, the laser ray from the laser oscillator 4 passes through the light shielding switch 11, and accordingly the fixed position of the SOS wafer 12 on the vacuum chuck 3 is irradiated therewith through the optical system 5, resulting in the formation of a scribing line 13 on the surface of the SOS wafer 12. At the time of T2, the DC motor stops, thus the second table 22 stops, the light shielding switch turns OFF and then shields the laser ray from the laser oscillator 4, and simultaneously a pulse motor starts.</p> |
