| 摘要 |
FIELD: electronics.SUBSTANCE: invention relates to solid-state electronics, particularly to heat sinks of high-power semiconductor devices and can be used in various engineering devices operating with high specific heat loads. Diamond heat sink is made in form of layered structure of diamond plates, wherein thickness of layer structure exceeds minimum along surface of structure of local heat source size.EFFECT: technical result is increased output power from local heat source.7 cl, 4 dwg |
