| 摘要 |
PURPOSE:To improve the insulating property, moisture resistance and mechanical strength of a semiconductor device package and to reduce the size by sealing with resin the inside of a semiconductor chip and a plurality of leads aligned and led out, cutting the leads which are disposed at the intermediate and not connected externally from the root side, and sealing the residue side of the cut leads, the rear end side of other leads and the outer periphery of inner resin sealer with external resin sealer. CONSTITUTION:A semiconductor chip 17 is mounted on the bonding pad 21 of a lead frame 20, electrodes on the upper surface of the chip, the cathode leads 22 of the frame 20 and the gate leads 24 are wire bonded between the corresponding electrodes. The chip 17 which is wire bonded is sealed with molding inner sealing resin 18. Anode leads 23 are press cut at a punched hole 26, and the root of a tie bar 25. The inner sealing resin 18 and the remaining hole 26 side of the anode leads 23 are completely covered with external sealing resin 19 by molding to hermetically seal them. |
