发明名称 MANUFACTURE OF ELECTRONIC COMPONENT
摘要 PURPOSE:To enable to manufacture surface mounting type electronic components at a low cost by a method wherein what is coaxially provided with a fine and long lead part is used for the large diameter end surface of a stepped cylindrical electrode, and the lead part is cut and removed after hermetic sealing. CONSTITUTION:A pair of the stepped cylindrical electrode 13 with lead parts consisting of the small diameter part 2 and the large diameter part 5 wherein the fine lead part 12 is coaxially provided on the end surface of the large diameter part 5 are prepared. After one of these electrodes 13 is supported in vertical manner, a glass tube 1 is inserted into the small diameter part 2 of this electrode 13. Thereafter, a chip 3 is put into this glass tube 1, and the other electrode 13 is inserted into the glass tube 1 from the side of the small diameter part 2. Then, the chip 3 is held between the end surfaces of a pair of the small diameter parts 2 in the glass tube 1. Next, the chip 3 is hermetically sealed by heat-fusing the glass tube 1. A surface mounting type diode 14 is manufactured by cutting the lead parts 12 at the end surface part of the large diameter parts 5. This manufacture unnecessitates new equipment investment and accordingly enables to manufacture the diode 14 at a low cost.
申请公布号 JPS5940555(A) 申请公布日期 1984.03.06
申请号 JP19820149334 申请日期 1982.08.30
申请人 HITACHI SEISAKUSHO KK 发明人 TERAKADO HAJIME
分类号 H01L23/08;H01L23/051;H01L23/48 主分类号 H01L23/08
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