| 摘要 |
PURPOSE:To enable to miniaturize hybrid integrated circuits and mount them at high density by a method wherein connection parts in clip form are formed in the direction nearly vertical to the lead part. CONSTITUTION:Two frame parts 11 and 12 extend respectively in horizontal direction and in parallel. The lead parts 13 and 14 so extend respectively toward the inside as to join both between these frames 11 and 12, the top end parts of the lead parts 13 and 14 are made continuous in an integral body, and accordingly the continuous part of the top end parts of the both is a wide width part 15. The connection part 16 in clip form is formed at this wide width part 15. Therefore, this connection part 16 extend vertical to the lead part 13 and 14 formed in horizontal direction. The side end part of a hybrid integrated circuit substrate 5 loaded with various kinds of electronic components 6 is fitted into this connection part 16. Thereafter, the unnecessary frame parts 11, 12 and lead parts 13, 14 are cut, and then each lead part 13 and 14 is so bend downward as to be inserted into a printed substrate. Thereby, the height of the entire body of a hybrid integrated circuit can be made low, resulting in its miniaturization. |
