Chip component which can be dip-soldered, for use in circuit boards

摘要

A chip component (1) which can be dip-soldered, for use in circuit boards, has two contact layers (2, 3), which can be soldered, on its side surfaces. Micro-capsules (5) are mounted on the underneath of the chip (1), by means of a cured adhesive layer (4). Located in the micro-capsules (5) is a rapid-curing adhesive which emerges from the bursting micro-capsules (5) when the chip (1) is pressed onto the circuit board.