| 摘要 |
PURPOSE:To enable the deposition of lead having metal bondability and an optional thickness on the surface of a metallic pipe, by moving the metallic pipe relatively with the free surface of the molten lead in a tank and moving an internal cooling means for the metallic pipe in follow-up to said movement. CONSTITUTION:A metallic pipe 3 which is beforehand treated with a flux is lowered together with a cooling means consisting of a cooling air supply pipe 13 and an internal cooler 14 by a lifting means 11 so as to be immersed in the molten lead 8 in a molten lead tank 7, by which the pipe is heated. The pipe is brought into reaction with the flux and is thus activated, whereafter the pipe 3 is pulled by the means 11 under cooling with cooling air 15. The pipe 3 is rotated by a rotating device 17 according to need in this stage. Then the pipe is cooled by the air 15 ejecting from the nozzles 14a of the device 14 and the molten lead in the weir 12 is cooled down to the solidification point, whereby the solidified lead 2 is formed in the metallically bonded state on the surface of the pipe 3. |
