| 摘要 |
PURPOSE:To reduce the waste of a wire material for wiring, and the number and time of bonding, and to improve the yield of an external appearance and the reliability of a wire bonding method by selectively wire bonding only a bonding pad used for inputting/outputting and a conductive part. CONSTITUTION:A wire 5 is not bonded to unused bonding pads A, E and an inner lead 4 corresponding thereto, but selectively bonded only to bonding pads B, C, D used for inputting/outputting. Since such a selective wire bonding can be readily executed for each type of pellets 1 by using a coordinate recognition of bonding with an RAM system or the like, wire material can be saved, the number of bonding steps and time can be shortened, and the yield of an external appearance and reliability can be improved. |
