| 摘要 |
PURPOSE:To prevent the cracks, breakages, etc. of a semiconductor chip by forming an irregular section to the surface of a loading member to be die- bonded. CONSTITUTION:The irregular sections are formed to the surface of a semiconductor-chip fitting region of the loading member on which the semiconductor- chip is joined through brazing. The irregular sections such as semispherical projections 13 in height of several microns or more are formed extending over approximately the whole surface of a stage 2. Or columnar projections 14 in height of several microns are formed as checkers. Accordingly, a solder material also intrudes into the valleys of the projections 13 or 14, the thickness of the solder material is thickened only in one parts, a plane-to-plane bonding between the back of the semiconductor chip and the surface of the stage is avoided, and the semiconductor chip is bonded on the stage 2 without generating the cracks, breakages, etc. of the chips. |
