| 摘要 |
An electrical connector or modular jack for directly coupling a printed circuit board and a standard, miniature, telephone-style modular plug. The jack housing includes an opening in the front portion thereof for receiving the modular plug that features a plurality of planar, insulation-piercing contact terminals. The jack includes conductors having spring contact portions that extend angularly forwardly from the rear part of the opening to be engaged with the similarly spaced contact terminals of the modular plug. The other ends of the jack's conductors extend normally from an outer wall of the housing in an alternating, staggered fashion to fit within correspondingly spaced apertures in the printed circuit board. An alternate embodiment provides a low profile modular jack particularly adapted for use with closely-spaced printed circuit boards. The low profile embodiment features a side-mounted latching assembly.
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