| 摘要 |
PURPOSE:To reduce resin burrs by coining to the outside of a resin seal except for a part therein. CONSTITUTION:A lead frame consists of inner leads made up of semiconductor chip mounting parts 1 and metallic wire bonding parts 2 and an outer lead 3. Except for a part in the resin seall 4, the lead is coined at a part at the mounting parts 1, the stitch parts 2, and a part of said seal. This constitution makes the resin burr 5 rectangular, which is easy to be removed in a post process and gets the tensile force increased because of the same case that a projection 6 is formed in the resin 4. |
