| 摘要 |
PURPOSE:To improve thermal resistance and to improve the heat sink of a ceramic substrate by superposing and baking the surface formed with a circuit of a circuit forming ceramic plate and the surface formed with the surface heat sink conductor unit of the plate to become the front side. CONSTITUTION:Tungsten paste is printed on one surface of a green sheet 1 to form a circuit 2, and a heat transfer conductor 3 is formed on the other surface as a circuit forming ceramic plate 4. Holes 5 are opened at the other green sheet 1, tungsten paste is densely filled in the holes, a surface heat sink conductor 6 is formed on one surface as a conductor forming ceramic plate 7. Then, the surface formed with the circuit 2 of the plate 4 and the surface formed with the surface heat sink conductor 6 of the plate 7 are superposed to become the front side, press-bonded, heated at 200 deg.C in the air, heated and baked to 1,550 deg.C in atmosphere, and then plated to obtain a ceramic wiring plate. |
