发明名称 Heat dissipation apparatus
摘要 A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with the insulating plate and a cathode connected with the conductive plate. A conductive element is received in the insulating plate and is connected to the anode of the power source. When the heat dissipation apparatus is activated, the conductive element ionizes air closing to the insulating plate to produce positive ions. The conductive plate attracts the positive ions to move fast towards the conductive plate, which cause the air to flow in a direction in which the positive ions move.
申请公布号 US9521779(B2) 申请公布日期 2016.12.13
申请号 US201414500342 申请日期 2014.09.29
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 Chiu Hsien-Huan
分类号 H01T23/00;H05F3/00;H05K7/20;G06F1/20 主分类号 H01T23/00
代理机构 代理人 Ma Zhigang
主权项 1. A heat dissipation apparatus for dissipating heat by movement of air, comprising: a perforated non-conductive insulating plate; a perforated conductive plate; and a conductive element, wherein, the conductive element is positioned upon the non-conductive insulating plate; wherein, the heat dissipation apparatus is electrically connectable to a power source having an anode and a cathode, with the anode being electrically connected to the conductive element and the cathode being electrically connected to the conductive plate; wherein, the non-conductive insulating plate is positioned substantially parallel to the conductive plate; and wherein, when the power source is activated, the conductive element generates an electric field producing positive ions in air and the conductive plate generates negative ions causing air movement towards the conductive plate.
地址 New Taipei TW