CIRCUIT BOARDS MADE OF LAMINATES,申请号IE19850000184-传众专利搜索

发明名称	CIRCUIT BOARDS MADE OF LAMINATES
摘要	<p>Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.</p>
申请公布号	IE850184(L)	申请公布日期	1985.07.27
申请号	IE19850000184	申请日期	1985.01.25
申请人	SIEMENS A.G.	发明人
分类号	B32B15/08;B32B15/092;C08G59/00;C08G59/44;C08J5/24;H05K1/03;(IPC1-7):H05K1/03	主分类号	B32B15/08
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