发明名称 CUTTING METHOD AND DEVICE FOR TILE
摘要 PURPOSE:To mechanize a tile cutting operation in such a way that a cluster of baked laminating tile material is transfered being supported in standing state by a fall preventive device and is beaten on the top during moving to be teared off and the pieces of tile are dropped on a high speed conveyor at a cutting position. CONSTITUTION:A cluster of baked laminating material T is supported by a fall preventive device 10 at the end surface and is transferred being supported in standing state on a transfer conveyor 13. And beating members 25 and 25a are lowered and elevated contineously to beat the cluster of tile material T at a tile tearing device 22. By this beating, the tile material T is teared off into the pieces of material. Then, at a catering position 8, each of pieces is dropped one by one on a high speed conveyor 31 running under the transfer conveyor 3 and is conveyed. By means of this constitution a tile cutting operation can be machanized.
申请公布号 JPS60248514(A) 申请公布日期 1985.12.09
申请号 JP19840104088 申请日期 1984.05.22
申请人 GOTOU TEKKOSHO:KK 发明人 YASUI SHIROU
分类号 B65G47/88;B28B17/00;B65H29/54 主分类号 B65G47/88
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