| 摘要 |
<p>PURPOSE:To bring a semiconductor pellet and a slag electrode into contact completely by bringing residual stress in a glass sleeve in a welding section between the slag electrode and the glass sleeve to a specific value or more. CONSTITUTION:A semiconductor pellet 4 in which a bump electrode 3 is fixed to one surface of a semiconductor base body 2 to which a P-N junction is formed is arranged between a pair of slag electrodes 1. A glass sleeve 5 is mounted extending over the electrodes 1, and the sleeve 5 is melted through heating and welded to the electrodes 1, thus hermetically sealing the pellet 4. When a difference between the thermal expansion coefficients of the electrode 1 and the sleeve 5 is increased at that time, residual stress is generated in the sleeve 5, and residual stress through which the sleeve 5 positioned at a pellet 4 section is drawn near is generated in the sleeve 5 in order to relax said residual stress, thus improving pressure welding force between the electrode 1 and the pellet 4. When residual stress in the sleeve 5 in a welding section extends over 60kg/cm<2> or more, defective disconnection is not generated due to intermittent conduction.</p> |
