| 摘要 |
PURPOSE:To complete a development process with a small amt. of a developing soln. in a short period by subjecting the photosensitive film coated on a semiconductor wafer to prescribed exposure then developing and rinsing the film while applying ultrasonic oscillation thereto. CONSTITUTION:The semiconductor wafer 100 of which the photosensitive film is subjected to the prescribed exposure is placed atop the chuck 101 and while the wafer is attracted by an evacuating pump 102, the chuck 101 is rotated by a motor 103 and at the same time the chuck 101 and the wafer 100 are oscillated by the output from an ultrasonic oscillator 1. The wafer 100 and the chuck 101 are enclosed by a cup 105 and the developing soln. and rinse liquid (pure water) are dropped from a nozzle 104 by which the wafer is developed and rinsed. The waste liquid is discharged from the hole 105a at the bottom. The development is thus executed uniformly with the small amt. of the developing soln. in the short period. |
