| 摘要 |
PURPOSE:To obtain excellent high-frequency characteristics while preventing the creep-up, etc. of solder on a mounting to a substrate by forming a metallized section inside a vessel and connecting a sealing section to a grounding terminal through the metallized section. CONSTITUTION:The inside of the side wall 3 of a small-sized airtight vessel is metallized 4, and a semiconductor 7 is connected to a lead 5 as a grounding terminal through a bonding section 2, a mount section 21 for the semiconductor 7 and an external metallized section 10. The surface of the metallized section 4 on the inside of the side wall is coated partially 15 with a ceramic film, thus preventing a flow-down to a bonding section for a bonding wire 8 through the metallized section 4 of an adhesive material in the bonding section 2. The sealing section 2 is connected finally to the grounding terminal, thus generating no resonance at high frequency, then realizing a semiconductor device having stable characteristics. |
