| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing wiring having improved allowable current density.SOLUTION: An embodiment of the present invention is a method for producing wiring including: a step (a) of forming a Ti film 12 on an insulation film 11 by means of a sputtering method; a step (b) of forming a TiN film 13 on the Ti film by means of a sputtering method; and a step (c) of forming an AlCu alloy film 14 on the TiN film by means of a sputtering method. The steps (a), (b) and (c) are performed without exposure to the atmosphere.SELECTED DRAWING: Figure 1 |
